BoHrSonic U2
Desktop Digital Ultrasonic Non-Destructive Testing System
Designed for industrial non-destructive testing, the system captures internal defect and interface quality data in situ, delivers micron-level high-resolution ultrasonic C-scan imaging, and identifies delamination, voids, and weak soldering defects.
BoHrSonic U2 Applications
For internal structure and interface quality inspection of semiconductor power modules, chip packaging, relay contact welding, lithium batteries, and related workpieces.
Water-Immersion C-Scan Imaging
Capture reflected echo images inside workpieces in a water-coupled environment for delamination, void, and interface quality analysis.
Semiconductor Ultrasonic NDT
Locate defects in bonding, welding, packaging interfaces, and multilayer structures of IGBT modules and chip packages.
Relay Contact Weld Inspection
Measure brazing area ratio through ultrasonic C-scan image analysis and thresholding to evaluate copper-silver contact weld quality.
Lithium Battery Ultrasonic Inspection
Inspect internal layer changes after repeated charge-discharge damage without disassembling battery cells or packs.
System Architecture and Acquisition Capability
The system consists of a computer, scanning platform, control circuit, transmitting circuit, receiving circuit, and ultrasonic probe, supporting data storage and real-time image display.
Computer
Scanning Platform
Control Circuit
Transmitting Circuit
Receiving Circuit
Ultrasonic Probe
Self-developed digital ultrasonic acquisition card with 50 MHz-1 GHz acquisition frequency
10-bit A/D conversion, 2 GB memory capacity, and 1000M Ethernet communication
Networkable multi-channel synchronous and asynchronous excitation and acquisition
BoHrSonic U2 Technical Parameters
Organized by motion platform, acquisition system, imaging software, and expandable configuration for rapid solution evaluation.
Motor-Driven Platform
- Repeat positioning accuracy
- X/Y/Z axes 0.005-0.01 mm/m
- Scan resolution (XY axes)
- ≤0.005 mm
- Scan range
- 400 × 400 × 100 mm, customizable
- Scan speed
- ≤150 mm/s
- Imaging resolution (Z axis)
- ≤0.08 × 0.08 mm with a 20 MHz transducer
Digital Ultrasonic Acquisition System
- Transducer frequency
- 20 MHz and above
- Pulse receiver bandwidth
- 50-500 MHz
- Pulse receiver sampling rate
- 0.2-1 GHz
- Communication interface
- 100M network interface
Custom Imaging Software
- Software functions
- A-scan and C-scan ultrasonic amplitude imaging
- AI-assisted imaging
- Available with workstation
- Automatic scanning
- Available
- Gate time
- 30-1000 ns
- Excitation pulse width
- 10-500 ns
- Time of flight (TOF)
- Precisely selectable TOF with 10 ns step
- Stability
- Good
Expandable Configuration
- Open data
- External devices
- Deep learning workstation
- 1-2 units, customizable
- Memory
- 16-128 GB, customizable
- Display
- 20-32 inches, customizable